Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.
1～6 item / All 6 items
High heat dissipation performance of λGEL (Lambda Gel) utilizing close contact and follow-up properties.
Thermal conductive material using αGEL (Alpha Gel), a very soft gel-like material developed by Taika Co., Ltd., primarily made from silicone.
It is made of a very soft material, so it covers the contact surface even in uneven areas and efficiently absorbs heat from each heating component.
It closely adheres to the surface irregularities and quickly conducts heat from the heating element to the heat sink. It is a thermal conductive material that fills gaps with a soft material. 【Features】 ● Achieves high thermal conductivity by uniformly dispersing and blending special fillers. ● The insulating type boasts high insulation properties of 10 to 15. CTI level is 600. ● Can be compressed to less than half its thickness, significantly reducing thermal resistance. ● Due to the properties of silicone resin, it exhibits advanced waterproof and dustproof capabilities. ● Obtained flame retardant UL V-0 certification. Passes the glow wire test at 675°C. ● Maintains high flexibility under a wide range of temperature conditions, protecting electronic devices from vibrations. ● RoHS compliant product.
![Electronic materials for heat dissipation design - high thermal conductivity materials [*Contributes to the heat dissipation design of substrates!*]](https://image.mono.ipros.com/public/product/image/c30/2000148681/IPROS7474383131751844224.jpg?w=280&h=280)
High thermal conductivity materials that support the heat dissipation design of substrates equipped with high-brightness LEDs and power semiconductors.
Electronic materials for heat dissipation design include high thermal conductivity materials that feature a high thermal conductivity insulating layer on the surface of aluminum or copper plates, as well as products such as copper foil laminated materials and white printed circuit board materials that excel in UV discoloration resistance and heat discoloration resistance. We support the heat dissipation design of substrates equipped with high-brightness LEDs and power semiconductors. *For more details, please download the catalog or contact us directly.
It has become possible to incorporate the function of a heat sink into the structure itself!
We would like to introduce Nanzen Chemical Industry's "High Thermal Conductivity Materials." It is possible to incorporate the function of a heat sink into the structure itself. Additionally, it is also possible to create insulated heat sinks, which is difficult with metals. We can achieve thermal conductivity that is approximately 10 to 200 times greater than that of general resins. As a comprehensive parts manufacturer centered on plastic molding, our company provides total solutions to realize our customers' "more" based on the technology we have cultivated over many years. [Features] - It is possible to incorporate the function of a heat sink into the structure itself. - Insulated heat sinks are also possible. - We can achieve thermal conductivity that is approximately 10 to 200 times greater than that of general resins. *For more details, please refer to the PDF document or feel free to contact us.
![[Product Catalog] Comprehensive Manufacturer of Thermal Management and EMI/EMC Materials](https://image.mono.ipros.com/public/product/image/78d/2000691947/IPROS50032305120779832513.jpeg?w=280&h=280)
As a comprehensive manufacturer of thermal management and EMI/EMC materials, we produce high-quality products tailored to our customers' needs. Let's maximize the benefits for our customers.
[Featured Products] ■ Silicone Gel ■ Silicone Pad ■ Graphite Sheet ■ Thermal Conductive Double-Sided Tape ■ Copper Foil Tape ■ Conductive Shielding Tape / Conductive Fabric Tape ■ Shielding Foam / Conductive Gasket / EMI Shielding Components *For more details, please download the PDF or contact us.*
Design of thermal conductive materials using high insulation polymers and tips for filler selection, effectiveness, and resistance measurement evaluation.
Part 1: The Destruction Mechanism of Polymer Insulating Materials and the Effect of Fillers Part 2: Measurement and Evaluation of Insulation Resistance Necessary for the Development and Application of Polymer Insulating Materials Sumitomo Metal Technology Co., Ltd. Research Support Division, Analysis Technology Department, Analysis Technology Office, Reliability Group, Mr. Koji Shioya [Profile] Based on experience in transmission characteristics of IC packages, circuit simulation technology, and PC motherboard design and development, currently responsible for electrical evaluation of metals, resin materials, and finished products. [Keywords] 1. Insulation resistance measurement 2. Insulation breakdown voltage measurement 3. Resin, filler, temperature dependence Part 3: Design Philosophy of Thermally Conductive Insulating Materials and Considerations for Filler Selection, Development Direction Sumitomo Osaka Cement Co., Ltd. Building Materials Division, New Business Group, Department Manager, Mr. Noriyuki Kosakai [Keywords] 1. Thermal conductive materials, resin, molding materials, electrical insulation, insulation 2. Epoxy, liquid, sealing, adhesion, high thermal conductivity 3. Silicon, thermoplastic, thermosetting
